STM32F407VGT6 STMicroelectronics, STM32F407VGT6 Datasheet - Page 21

IC MCU 32BIT 1MB FLASH 100LQFP

STM32F407VGT6

Manufacturer Part Number
STM32F407VGT6
Description
IC MCU 32BIT 1MB FLASH 100LQFP
Manufacturer
STMicroelectronics
Datasheets

Specifications of STM32F407VGT6

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
168MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
82
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
192K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Core
ARM Cortex M4
Processor Series
STM32F4
Data Bus Width
32 bit
Maximum Clock Frequency
168 MHz
Data Ram Size
192 KB
On-chip Adc
Yes
Number Of Programmable I/os
82
Number Of Timers
10
Operating Supply Voltage
1.7 V to 3.6 V
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
16
Interface Type
CAN, I2C, I2S, SPI, UART
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11605

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STM32F405xx, STM32F407xx
2.2.12
2.2.13
2.2.14
Note:
pulse width shorter than the Internal APB2 clock period. Up to 140 GPIOs can be connected
to the 16 external interrupt lines.
Clocks and startup
On reset the 16 MHz internal RC oscillator is selected as the default CPU clock. The
16 MHz internal RC oscillator is factory-trimmed to offer 1% accuracy over the full
temperature range. The application can then select the system clock between the RC
oscillator and an external 4-26 MHz clock source. This clock can be monitored for failure. If a
failure is detected, the system automatically switches back to the internal RC oscillator and
a software interrupt is generated (if enabled). This clock source is input to a PLL thus
allowing to increase the frequency up to 168 MHz. Similarly, full interrupt management of
the PLL clock entry is available when necessary (for example if an indirectly used external
oscillator fails).
Several prescalers allow the configuration of the two AHB buses, the high-speed APB
(APB2) and the low-speed APB (APB1) domains. The maximum frequency of the two AHB
buses is 168 MHz while the maximum frequency of the high-speed APB domains is 84 MHz.
The maximum allowed frequency of the low-speed APB domain is 42 MHz.
The devices embed a dedicated PLL (PLLI2S) which allows to achieve audio class
performance. In this case, the I
frequencies from 8 kHz to 192 kHz.
Boot modes
At startup, boot pins are used to select one out of three boot options:
The boot loader is located in system memory. It is used to reprogram the Flash memory by
using USART1 (PA9/PA10), USART3 (PC10/PC11 or PB10/PB11), CAN2 (PB5/PB6), USB
OTG FS in Device mode (PA9/PA11/PA12) through DFU (device firmware upgrade).
Power supply schemes
Refer to
V
temperature range with PDR_ON connected to V
DD
/V
Boot from user Flash
Boot from system memory
Boot from embedded SRAM
V
enabled), provided externally through V
V
RCs and PLL. V
V
registers (through power switch) when V
DD
SSA
BAT
DDA
Figure 18: Power supply scheme
= 1.8 to 3.6 V: external power supply for I/Os and the internal regulator (when
, V
= 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup
minimum value of 1.7 V is obtained when the device operates in the 0 to 70 °C
DDA
= 1.8 to 3.6 V: external analog power supplies for ADC, DAC, Reset blocks,
DDA
and V
Doc ID 022152 Rev 1
2
SSA
S master clock can generate all standard sampling
must be connected to V
for more details.
DD
DD
pins.
is not present.
SS
.
DD
and V
SS
, respectively.
Description
21/154

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