STM32F407VGT6 STMicroelectronics, STM32F407VGT6 Datasheet - Page 85

• Manufacturer Part Number: STM32F407VGT6
• Description: IC MCU 32BIT 1MB FLASH 100LQFP
• Manufacturer: STMicroelectronics

Specifications of STM32F407VGT6

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 168MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Core: ARM Cortex M4
• Processor Series: STM32F4
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 168 MHz
• Data Ram Size: 192 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 82
• Number Of Timers: 10
• Operating Supply Voltage: 1.7 V to 3.6 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 16
• Interface Type: CAN, I2C, I2S, SPI, UART
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11605

STM32F405xx, STM32F407xx
A device reset allows normal operations to be resumed.
The test results are given in
defined in application note AN1709.
Table 38.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
●
●
●
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
V
V
Symbol
FESD
EFTB
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
EMS characteristics
Parameter
Table
Doc ID 022152 Rev 1
38. They are based on the EMS levels and classes
DD
and V
SS
V
f
IEC 61000-4-2
V
f
IEC 61000-4-2
HCLK
HCLK
DD
DD
= 3.3 V, LQFP100, T
= 3.3 V, LQFP100, T
= 84 MHz, conforms to
= 84 MHz, conforms to
Conditions
Electrical characteristics
A
A
= +25 °C,
= +25 °C,
Level/
Class
85/154
2B
4A