STPCC4 STMicroelectronics, STPCC4 Datasheet - Page 60

• Manufacturer Part Number: STPCC4
• Description: STPC CONSUMER-II DATASHEET - X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP
• Manufacturer: STMicroelectronics

MECHANICAL DATA
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
60/93
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Figure 5-5. Thermal Dissipation Without Heatsink
Rca
Rjc
Rjb
Rba
Figure 5-4. 388-Pin PBGA structure
Board
Release 1.5 - January 29, 2002
8.5
Rja = 13 C/W
6
Junction
Ambient
Thermal balls
6
125
Case
The structure in shown inFigure 5-4.
Thermal dissipation options are illustrated in
Figure 5-5 and Figure 5-6.
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17 m for internal layers
- 34 m for external layers
Airflow = 0
Board temperature taken at the centrecentre ba
Power & Ground layers