IDT72291L20TFI IDT, Integrated Device Technology Inc, IDT72291L20TFI Datasheet - Page 25

• Manufacturer Part Number: IDT72291L20TFI
• Description: IC FIFO 65536X18 LP 20NS 64QFP
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: 7200r

Specifications of IDT72291L20TFI

• Function: Synchronous
• Memory Size: 1.1M (65K x 18)
• Data Rate: 50MHz
• Access Time: 20ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-STQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 72291L20TFI

DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
than 65,536 and 131,072 for the IDT72291 with a 9-bit bus width. In FWFT
mode, the FIFOs can be connected in series (the data outputs of one FIFO
connected to the data inputs of the next) with no external logic necessary. The
resulting configuration provides a total depth equivalent to the sum of the depths
associated with each single FIFO. Figure 24 shows a depth expansion using
two IDT72281/72291 devices.
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain–no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the data
word appears at the outputs of one FIFO, that device's OR line goes LOW,
enabling a write to the next FIFO in line.
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
where N is the number of FIFOs in the expansion and T
Note that extra cycles should be added for the possibility that the t
IDT72281/72291
CMOS SuperSync FIFO™ 65,536 x 9 and 131,072 x 9
The IDT72281 can easily be adapted to applications requiring depths greater
Care should be taken to select FWFT mode during Master Reset for all FIFOs
For an empty expansion configuration, the amount of time it takes for OR of
FWFT/SI
DATA IN
WRITE CLOCK
WRITE ENABLE
INPUT READY
n
(N – 1)*(4*transfer clock) + 3*T
Dn
WEN
IR
WCLK
Figure 22. Block Diagram of 131,072 x 9 and 262,144 x 9 Depth Expansion
FWFT/SI
72281
72291
IDT
•
TRANSFER CLOCK
RCLK
RCLK
RCLK
REN
OE
OR
Qn
is the RCLK period.
SKEW3
•
GND
25
n
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO
to write a word to fill it.
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
where N is the number of FIFOs in the expansion and T
period. Note that extra cycles should be added for the possibility that the t
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
The "ripple down" delay is only noticeable for the first word written to an empty
The first free location created by reading from a full depth expansion
For a full expansion configuration, the amount of time it takes for IR of the first
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
WCLK
IR
Dn
WEN
(N – 1)*(3*transfer clock) + 2 T
FWFT/SI
72281
72291
IDT
COMMERCIAL AND INDUSTRIAL
RCLK
REN
TEMPERATURE RANGES
OR
OE
Qn
WCLK
OUTPUT ENABLE
n
OUTPUT READY
READ ENABLE
WCLK
READ CLOCK
DATA OUT
4675 drw 25
is the WCLK
SKEW1