mpc5632m Freescale Semiconductor, Inc, mpc5632m Datasheet - Page 54

• Manufacturer Part Number: mpc5632m
• Description: Mpc5634m Microcontroller Data Sheet
• Manufacturer: Freescale Semiconductor, Inc

Electrical Characteristics
54
2
3
4
5
1
2
3
4
5
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test
board meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the
interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and
the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JT.
Thermal characteristics are targets based on simulation that are subject to change per device
characterization.
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test
board meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the
interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and
the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JT.
R
R
R
R
R
R
R
R
R
θJCtop
Ψ
θJMA
θJMA
θJMA
Symbol
θJA
θJA
θJB
Symbol
θJA
θJA
JT
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
Table 8. Thermal Characteristics for 208-pin MAPBGA
Junction-to-Ambient, Natural
Convection
Junction-to-Ambient, Natural
Convection
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Board
Junction-to-Case
Junction-to-Package Top, Natural
Convection
Junction-to-ambient, natural
convection
Junction-to-ambient natural
convection
Junction-to-ambient
Table 7. Thermal Characteristics for 176-pin LQFP
Preliminary—Subject to Change Without Notice
MPC5634M Microcontroller Data Sheet, Rev. 3
2
2
5
2,3
2,4
Parameter
Parameter
4
3
2
2
2,4
Single layer board - 1s
Four layer board - 2s2p
@200 ft./min., single
layer board - 1s
@200 ft./min., four layer
board - 2s2p
One layer board - 1s
@200 ft./min., one
Four layer board -
Conditions
Conditions
layer board
2s2p
1
1
Value
Value
Freescale Semiconductor
43
36
35
30
25
39
24
31
9
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit