mfrc52301hn1-trayb NXP Semiconductors, mfrc52301hn1-trayb Datasheet - Page 86

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mfrc52301hn1-trayb

Manufacturer Part Number
mfrc52301hn1-trayb
Description
Contactless Reader Ic
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
17. Package outline
Fig 33. Package outline SOT617-1 (HVQFN32)
MFRC523_33
Product data sheet
PUBLIC
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT617-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
8
1
b
- - -
IEC
0.2
9
32
c
e
D
5.1
4.9
(1)
3.25
2.95
D h
e 1
D h
D
All information provided in this document is subject to legal disclaimers.
MO-220
JEDEC
1/2
0
E
5.1
4.9
e
(1)
REFERENCES
b
Rev. 3.3 — 5 March 2010
3.25
2.95
E h
25
16
0.5
e
115233
17
24
JEITA
scale
- - -
B
2.5
1/2
e
3.5
e
e 1
w
A
E
v
e 2
M
M
C
C
3.5
e 2
A
B
0.5
0.3
L
5 mm
0.1
A
v
A 1
y 1 C
0.05
w
PROJECTION
EUROPEAN
0.05
detail X
y
0.1
y 1
Contactless reader IC
X
C
MFRC523
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
01-08-08
02-10-18
SOT617-1
c
86 of 98

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