mc9s08sg4 Freescale Semiconductor, Inc, mc9s08sg4 Datasheet - Page 283

• Manufacturer Part Number: mc9s08sg4
• Description: 8-bit Microcontroller Family
• Manufacturer: Freescale Semiconductor, Inc

A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
Freescale Semiconductor
1
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Junction to Ambient Natural Convection
Num
Thermal Characteristics
1
2
3
4
SS
or V
—
D
D
D
C
DD
I/O
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and multiply by the pin current for each I/O pin. Except in cases of unusually high
into account in power calculations, determine the difference between actual pin
Single-layer board
Four-layer board
MC9S08SG8 MCU Series Data Sheet, Rev. 3
Table A-3. Thermal Characteristics
Rating
1,2
1,2
8-pin NB SOIC
8-pin NB SOIC
16-pin TSSOP
20-pin TSSOP
16-pin TSSOP
20-pin TSSOP
M
C
V
Symbol
θ
θ
T
T
JA
JA
A
J
SS
or V
DD
Appendix A Electrical Characteristics
–40 to 105
–40 to 125
–40 to 85
T
will be very small.
L
Value
135
167
123
115
115
75
76
to T
H
°C/W
°C/W
Unit
°C
°C
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