a3pn010 Actel Corporation, a3pn010 Datasheet - Page 19

• Manufacturer Part Number: a3pn010
• Description: Proasic 3 Nano Flash Fpgas
• Manufacturer: Actel Corporation

Table 2-4 •
Package Type
Ceramic Column Grid Array (CCGA)
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction temperature to be higher than the ambient temperature.
EQ 2-1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
resistivity is θ
recommended maximum junction temperature is 125°C.
recommended maximum power dissipation allowed for a 484-pin CCGA package with the junction
at 125°C and with the case temperature maintained at 70°C.
Package Thermal Resistivities
A
ja
= Ambient Temperature
= Junction-to-ambient of the package. θ
T
J
Maximum Power Allowed
= Junction Temperature = ΔT + T
can be used to calculate junction temperature.
ja
. The thermal characteristics for θ
RT3PE3000L
RT3PE3000L
RT3PE600L
Device
=
Max. junction temp. (°C) Max. case temp. (°C)
---------------------------------------------------------------------------------------------------------------------------- -
A
A dv a n c e v 0. 1
Pin Count
Radiation-Tolerant ProASIC3 DC and Switching Characteristics
484
484
896
ja
numbers are located in
θ
TBD
TBD
TBD
jc
θ
(°C/W)
jc
ja
jc
–
and the junction-to-ambient air thermal
are shown for two air flow rates. The
Still Air 200 ft./min. 500 ft./min.
EQ 2-2
TBD
TBD
TBD
shows a sample calculation of the
Table
TBD
TBD
TBD
θ
ja
ja
2-4.
* P
TBD
TBD
TBD
EQ 2-1
EQ 2-2
Units
C/W
C/W
C/W
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