m393b5173dz1 Samsung Semiconductor, Inc., m393b5173dz1 Datasheet - Page 3

• Manufacturer Part Number: m393b5173dz1
• Description: Ddr3 Sdram
• Manufacturer: Samsung Semiconductor, Inc.

17.0 Electrical Characteristics and AC timing ............................................................................................................... 36
18.0 Timing Parameters for DDR3-800, DDR3-1066 and DDR3-1333 ........................................................................... 39
19.0 Physical Dimensions : ............................................................................................................................................ 55
Registered DIMM
17.1 Refresh Parameters by Device Density .......................................................................................................... 36
17.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ....................................................... 36
17.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin ........................................................ 37
18.1 Jitter Notes ........................................................................................................................................................ 42
18.2 Timing Parameter Notes ................................................................................................................................... 43
18.3 Address / Command Setup, Hold and Derating: ............................................................................................ 44
18.4 Data Setup, Hold and Slew Rate Derating: ..................................................................................................... 50
19.1 128Mbx8 based 128Mx72 Module(1 Rank) ..................................................................................................... 55
19.2 128Mbx8 based 256Mx72 Module(2 Ranks) ................................................................................................... 56
19.3 256Mbx4 based 256Mx72 Module(1 Ranks) ................................................................................................... 57
19.4 256Mbx4 based 512Mx72 Module(2 Ranks) ................................................................................................... 58
19.5 128Mbx8 based 512Mx72 Module(4 Ranks)................................................................................................... 61
19.6 8GB based 1Gx72 Module(4 Ranks) ............................................................................................................... 62
17.3.1 Speed Bin Table Notes ........................................................................................................................... 38
19.1.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs ................................................... 55
19.2.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs ................................................... 56
19.3.1 x72 DIMM, populated as one physical ranks of x4 DDR3 SDRAMs ................................................... 57
19.4.1 x72 DIMM, populated as one physical ranks of x4 DDR3 SDRAMs ................................................... 58
19.4.2 Heat Spreader Design Guide ................................................................................................................ 59
19.5.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs ................................................... 61
19.6.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs ................................................... 62
19.6.2 Heat Spreader Design Guide ................................................................................................................ 63
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Rev. 1.1 August 2008
DDR3 SDRAM