msm62x42b Oki Semiconductor, msm62x42b Datasheet - Page 27

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msm62x42b

Manufacturer Part Number
msm62x42b
Description
Real Time Clock Ic With Built-in Crystal
Manufacturer
Oki Semiconductor
Datasheet

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SUPPLEMENTARY DESCRIPTION
1. When "0" is written to the IRQ FLAG bit, the IRQ FLAG bit is cleared. However, if "0" is
2. Since the IRQ FLAG bit becomes "1" in some cases when rewriting either of the t
3. The relationship between SDT.P OUT and IRQ FLAG bit is shown below:
SUGGESTIONS FOR P.C.B ASSEMBLY
1. This IC can bear shock of fall from a height of 75 cm. However, the shock power of IC inserters
2. The notice for soldering differs in DIP product and SOP product.
3. The ultrasonic washing may damage the crystal resonator due to the use conditions.
4. Please keep parts free from dew.
assigned to the IRQ FLAG bit when written to the other bits, the 30-sec. ADJ bit and the
HOLD bit, the IRQ FLAG = 1 generated before the writing will be cleared. To avoid this,
always set "1" to the IRQ FLAG unless "0" is written to it intentionally. By writing "1" to it,
the IRQ FLAG bit does not become "1".
STND bit of register C
the IRQ FLAG = 1 to be generated after it.
might destroy resonators. It depends on the machines and conditions at your Company. We
recommended to adjust the machine conditions before mass production.
Therefore, we can not guarantee your use for the ultrasonic washing because of unknown
factors about a kind of washing machine, electric power, hour, place to be set in a bath, etc.
Be sure to confirm the use conditions before your use as well as with condition change when
you have to use the ultrasonic washing machine unavoidably.
(The ultrasonic washing machine of frequency 40 kHz can not be used for built-in the tuning
- fork resonator of 32.768 kHz, but the one of frequency 28 kHz has the range available due
to the conditions. However, be sure to confirm the setting conditions sufficiently for the
abovementioned reasons.)
• DIP Product
• SOP Product
Since the eutectic solder (melting point 183 C) is used for soldering the crystal resonator,
destruction of crystal resonator or degradation of characteristics of resonators can be
induced by high temperature (more than 150 C) inside the package. Soldering with
solder dip bath or manual soldering is recommendable. Please refrain from soldering by
hot air, reflow, infrared rays, etc. Soldering heat resistance test conditions : 260 C x 10
seconds. (Soldering for the lead must leave 1 mm from its base.)
Soldering by hand or soldering by infrared ray reflow based on the temperature profile
of our Company’s recommendation is desirable. (Refer to "Package information.)
E
, be sure to write "0" to the IRQ FLAG bit after writing to make valid
IRQ FLAG Bit
STD.P OUT
Approx. 1.95ms
open
" L "
1
0
MSM62X42B
1
, t
0
or ITRPT/
67

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