CHA5093TCF/24 UMS [United Monolithic Semiconductors], CHA5093TCF/24 Datasheet

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CHA5093TCF/24

Manufacturer Part Number
CHA5093TCF/24
Description
24-26GHz High Power Amplifier
Manufacturer
UMS [United Monolithic Semiconductors]
Datasheet

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Part Number:
CHA5093TCF/24
Manufacturer:
UMS
Quantity:
1 400
Description
The packaged monolithic microwave IC
(MMIC)
monolithic high power amplifier. It is
designed for a wide range of applications,
from military to commercial communication
systems.
The circuit is manufactured with a PM-
HEMT process, 0.25µm gate length, via
holes through the substrate, air bridges and
electron beam gate lithography. It is
supplied in a new SMD leadless chip
carrier.
SMD Package Dimensions
"Please note that PIN 1 is located in the lower left corner of the package (front-side view) for all SMD-type packages from United Monolithic Semiconductors.
It is indicated by a triangle on the package lid. Starting with PIN 1 the other pads are numbered counter-clockwise (front-side view). ATTENTION: The dot on
the backside of the package (i.e. side with metallic pads) is just for fabrication purposes and does NOT indicate the location of PIN
Ref. : DSCHA50932035 - 04-Feb.-02
GaAs Monolithic Microwave IC in SMD leadless package
is
a
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
high
24-26GHz High Power Amplifier
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
gain
United Monolithic Semiconductors S.A.S.
three-stage
1/6
Main Features
■ Performances: 24-26GHz
■ Gain = 19dB (typical)
■ Output power (P
■ SMD leadless package
■ Dimensions: 6.35 x 6.35 x 0.97 mm
Specifications subject to change without notice
CHA5093TCF
-1dB
) 29dBm (typical)
3

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CHA5093TCF/24 Summary of contents

Page 1

High Power Amplifier GaAs Monolithic Microwave IC in SMD leadless package Description The packaged monolithic microwave IC (MMIC high gain monolithic high power amplifier designed for a wide range of applications, from military to commercial ...

Page 2

CHA5093TCF Schematic CHA5093TCF CHA5093TCF Typical Bias Conditions for an ambient Temperature of +25°C Symbol Pin No. Vd1,2 & 8 Drain bias voltage Vg1,2,3 10 First, second & third stages gate bias voltage Idd 2,4 ...

Page 3

High Power Amplifier Typical results on PCB (recommended motherboard layout) Vd=6V, Id adjusted at 600mA 23GHz Footprint Ref. : DSCHA50932035 - ...

Page 4

CHA5093TCF Application note The design of the motherboard has a strong impact on the over all performance since the transition from the motherboard to the package is comparably large. In case of the SMD type packages of United Monolithic Semiconductors ...

Page 5

High Power Amplifier The RF ports comprise a DC blocking capacitor on chip level. The DC connections include a first level of DC decoupling capacitors (typically 120pF) in the package. However, all DC bias ports should be additionally connected ...

Page 6

... United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHA50932035 - 04-Feb.-02 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0 Fax : +33 (0 24-26GHz High Power Amplifier CHA5093TCF/24 6/6 Specifications subject to change without notice ...

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