MM908E624ACDWB/R Motorola, MM908E624ACDWB/R Datasheet - Page 29

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MM908E624ACDWB/R

Manufacturer Part Number
MM908E624ACDWB/R
Description
TRIPLE HIGH-SIDE SWITCH WITH EMBEDDED MCU AND LIN
Manufacturer
Motorola
Datasheet
© Freescale Semiconductor, Inc., 2004. All rights reserved.
Freescale Semiconductor
Technical Data
Integrated Triple High-Side
Switch with Embedded MCU
and LIN Serial Communication
for Relay Drivers
Introduction
the package independently heating with P
junction temperatures, T
with R
the reference temperature while only heat source 1 is heating with P
to the reference temperature while heat source 2 is heating with P
This applies to R
comparison of one package to another in a standardized
environment. This methodology is not meant to and will not predict
the performance of a package in an application-specific environment.
Stated values were obtained by measurement and simulation
according to the standards listed below.
Standards
Table 1.
R
R
R
R
Resistance
This package is a dual die package. There are two heat sources in
For m , n = 1, R
For m = 1, n = 2, R
The stated values are solely for a thermal performance
θJAmn
θJBmn
θJAmn
θJCmn
Thermal
θ JA mn
Thermal Performance Comparison
.
T
T
J1
J2
θ J21
θ JA11
m = 1,
=
n = 1
1 = Power Chip, 2 = Logic Chip (°C/W)
40
25
57
21
and R
θ JA12
R
R
is the thermal resistance from Junction 1 to
J1
θ JA21
θ JA11
and T
is the thermal resistance from Junction 1
θ J22
, respectively.
R
m = 1, n = 2
m = 2, n = 1
R
J2
θ JA12
θ JA22
, and a thermal resistance matrix
31
16
47
12
1
.
and P
P
P
1
2
2
. This results in two
m = 2,
n = 2
36
21
52
16
2
1
.
.
Note For package dimensions, refer to the 908E624
device datasheet.
908E624DW
54-TERMINAL SOICW
54-TERMINAL
98ASA99294D
DW SUFFIX
SOICW
MM908E624DWTAD
Rev 2.0, 12/2004

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