MM908E624ACDWB/R Motorola, MM908E624ACDWB/R Datasheet - Page 30

• Manufacturer Part Number: MM908E624ACDWB/R
• Description: TRIPLE HIGH-SIDE SWITCH WITH EMBEDDED MCU AND LIN
• Manufacturer: Motorola

Device on Thermal Test Board
908E624DW
32
PTB6/AD6/TBCH0
Material:
Outline:
Area A :
Ambient Conditions: Natural convection, still air
PTB7/AD7/TBCH1
PTD0/TACH0
PTD1/TACH1
PTC2/MCLK
PTC4/OSC1
PTC3/OSC2
PTB5/AD5
PTB4/AD4
PTB3/AD3
PTB1/AD1
PWMIN
RST_A
IRQ_A
RST
HS3
HS2
HS1
IRQ
NC
NC
NC
NC
NC
NC
L1
L2
908E624 Terminal Connections
17.9 mm x 7.5 mm Body
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54-Terminal SOICW
0.65 mm Pitch
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
NC
RXD
WDCONF
+E
-E
OUT
VCC
AGND
VDD
NC
VSUP1
GND
LIN
VSUP2
Figure 1. Thermal Test Board
Table 2.
ambient air.
that is heated. Index n refers to the number of the die where
the junction temperature is sensed.
Resistance
R
Terminal
R
This device is a dual die package. Index m indicates the die
θ
JA
θ JA mn
mn
is the thermal resistance between die junction and
Thermal Resistance Performance
Area A
(mm
300
600
0
A
2
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip (
m = 1,
n = 1
58
56
54
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
48
46
45
m = 2,
n = 2
53
51
50
°
C/W)