MM908E625ACDWB/R2 Motorola, MM908E625ACDWB/R2 Datasheet - Page 5

• Manufacturer Part Number: MM908E625ACDWB/R2
• Description: Integrated Quad Half H-Bridge with Power Supply / Embedded MCU / and LIN Serial Communication
• Manufacturer: Motorola

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage to
the device.
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltage
Input Terminal Voltage
Maximum Microcontroller Current per Terminal
Maximum Microcontroller V
Maximum Microcontroller V
LIN Supply Voltage
ESD Voltage
Storage Temperature
Operating Case Temperature (Note 5)
Operating Junction Temperature
Terminal Soldering Temperature (Note 6)
Thermal Resistance (Junction to Ambient)
1.
2.
3.
4.
5.
6.
7.
8.
9.
Analog Chip Supply Voltage under Normal Operation (Steady-State)
Analog Chip Supply Voltage under Transient Conditions (Note 1)
Microcontroller Chip Supply Voltage
Analog Chip
Microcontroller Chip
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
Normal Operation (Steady-State)
Transient Conditions (Note 1)
Human Body Model (Note 2)
Machine Model (Note 3)
Charge Device Model (Note 4)
Analog
MCU
All Outputs ON (Note 7), (Note 9)
Single Output ON (Note 8), (Note 9)
Transient capability for pulses with a time of t < 0.5 sec.
ESD1 testing is performed in accordance with the Human Body Model (C
ESD2 testing is performed in accordance with the Machine Model (C
ESD3 testing is performed in accordance with Charge Device Model, robotic (C
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
All outputs ON and dissipating equal power.
One output ON and dissipating power.
Per JEDEC JESD51-2 at natural convection, still air condition; and 2s2p thermal test board per JEDEC JESD51-7 and JESD51-5 (thermal
vias connected to top ground plane).
SS
DD
Output Current
Input Current
Rating
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
ZAP
V
V
BUS(DYNAMIC)
T
=200 pF, R
ZAP
IN
V
V
V
T
V
J(ANALOG)
Symbol
T
V
V
V
SOLDER
SUP(
SUP(
IN
I
I
I
BUS(SS)
I
R
R
(ANALOG)
PIN
PIN
T
J(MCU)
MVSS
MVDD
V
ESD1
ESD2
ESD3
T
θ
θ
STG
(MCU)
= 100 pF, R
DD
JA1
JA2
C
(1)
(2)
ZAP
SS
PK
)
)
=4.0 pF).
ZAP
= 0 Ω).
ZAP
= 1500 Ω).
V
SS
-0.3 to V
-0.3 to 6.0
-0.3 to 5.5
-40 to 150
-40 to 150
-40 to 125
-0.3 to 28
-0.3 to 40
-40 to 85
-18 to 28
±3000
Value
±150
±500
±15
±25
100
100
245
40
24
27
DD
+0.3
°C/W
Unit
908E625
mA
mA
mA
°C
°C
°C
°C
V
V
V
V
5