DAC1408D650HW/C1 NXP [NXP Semiconductors], DAC1408D650HW/C1 Datasheet - Page 80
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DAC1408D650HW/C1
Manufacturer Part Number
DAC1408D650HW/C1
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.DAC1408D650HWC1.pdf
(88 pages)
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NXP Semiconductors
12. Abbreviations
DAC1408D650_1
Objective data sheet
Table 183. Abbreviations
Acronym
BW
BWA
CDMA
CML
CMOS
DAC
EDGE
FIR
GSM
IF
IMD3
LMDS
LVDS
NCO
NMOS
PLL
SERDES
SFDR
SPI
WCDMA
WLL
Description
Bandwidth
Broadband Wireless Access
Code Division Multiple Access
Current Mode Logic
Complementary Metal Oxide Semiconductor
Digital-to-Analog Converter
Enhanced Data rates for GSM Evolution
Finite Impulse Response
Global System for Mobile communications
Intermediate Frequency
Third Order Intermodulation Product
Local Multipoint Distribution Service
Low-voltage Differential Signaling
Numerically Controlled Oscillator
Negative Metal-Oxide Semiconductor
Phase-Locked Loop
Serializer/Deserializer
Spurious Free Dynamic Range
Serial Peripheral Interface
Wideband Code Division Multiple Access
Wireless Local Loop
Rev. 01 — 26 May 2009
Dual 14-bit DAC, up to 650 Msps, 2 and 4 interpolating
DAC1408D650
© NXP B.V. 2009. All rights reserved.
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