MPC8358E_11 FREESCALE [Freescale Semiconductor, Inc], MPC8358E_11 Datasheet - Page 66
MPC8358E_11
Manufacturer Part Number
MPC8358E_11
Description
PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
1.MPC8358E_11.pdf
(95 pages)
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Package and Pin Listings
21.2
Mechanical Dimensions of the PBGA Package
Figure 52
depicts the mechanical dimensions and bottom surface nomenclature of the 668-PBGA package.
Figure 52. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
66
Freescale Semiconductor
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