MPC8358E_11 FREESCALE [Freescale Semiconductor, Inc], MPC8358E_11 Datasheet - Page 87
MPC8358E_11
Manufacturer Part Number
MPC8358E_11
Description
PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
1.MPC8358E_11.pdf
(95 pages)
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Table 76
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
MEI, 75
MEI, 75
MEI, 75
shows heat sinks and junction-to-ambient thermal resistance for PBGA package.
Table 76. Heat Sinks and Junction-to-Ambient Thermal Resistance of PBGA Package
Heat Sink Assuming Thermal Grease
Wakefield, 53
Wakefield, 53
Wakefield, 53
AAVID 30
AAVID 30
AAVID 30
AAVID 31
AAVID 31
AAVID 31
×
×
×
85
85
85
×
×
×
12 no adjacent board, extrusion
12 no adjacent board, extrusion
12 no adjacent board, extrusion
×
×
×
×
×
×
30
30
30
×
×
×
35
35
35
53
53
53
×
×
×
×
×
×
9.4 mm Pin Fin
9.4 mm Pin Fin
9.4 mm Pin Fin
×
×
×
23 mm Pin Fin
23 mm Pin Fin
23 mm Pin Fin
25 mm Pin Fin
25 mm Pin Fin
25 mm Pin Fin
603-224-9988
408-749-7601
818-842-7277
Natural Convection
Natural Convection
Natural Convection
Natural Convection
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
Thermal Resistance
29
×
29 mm PBGA
12.6
10.5
8.2
7.0
6.6
6.1
9.0
5.6
5.1
9.0
5.7
5.1
Thermal
87
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