BH616UV1611BI55 BSI [Brilliance Semiconductor], BH616UV1611BI55 Datasheet - Page 10

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BH616UV1611BI55

Manufacturer Part Number
BH616UV1611BI55
Description
Ultra Low Power/High Speed CMOS SRAM 1M X 16 bit / 2M x 8-bit
Manufacturer
BSI [Brilliance Semiconductor]
Datasheet
n ORDERING INFORMATION
n PACKAGE DIMENSIONS
R0201-BH616UV1611
Note:
Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does
not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result
in significant injury or death, including life-support systems and critical medical instruments.
VIEW A
BH616UV1611
48 mini-BGA (8 x 10mm)
SIDE VIEW
D 0.1
D1
X
X
Z Y Y
10
NOTES:
48
N
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
10.0
D
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green, RoHS Compliant
P: Pb free, RoHS Compliant
GRADE
I: -40
PACKAGE
D: Dice
B: BGA-48-0810
T: TSOP I-48
o
8.0
C ~ +85
E
BH616UV1611
5.25
D1
SOLDER BALL
o
C
3.75
E1
0.75
e
Revision
Otc.
0.35 ± 0.05
2006
1.3

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