AT89C51ED2-SMSIM ATMEL Corporation, AT89C51ED2-SMSIM Datasheet - Page 9

• Manufacturer Part Number: AT89C51ED2-SMSIM
• Description: 8-bit Flash Microcontroller
• Manufacturer: ATMEL Corporation

4.3 Wafer Level Reliability
4.3.1 Electromigration
Purpose:
To evaluate the AT56800, AT35500, and AT37000 processes for Metal 1, Metal 3 & Via Electromigration
Reliability. These 3 processes have the same steps for interconnect levels.
Test Parameters:
Metal 1 & Metal 3:
Sample Size = 15
Temp = 250C with Joule heating .
J = 3.5E06 A/cm2.
Via:
Sample Size = 15
Temp = 200C with Joule heating.
J = 2.5E06 A/cm2.
Black’s Equation Parameters:
Failure Criteria - 10% increase in resistance. Data taken every 1% change.
n = 2
Ea = 0.6eV
Lifetime Predictions:
Metal 1 :
Split 1 - Tf
(Sigma = 2.7118 hours, Accel
Metal 3 :
Split 3 - Tf
(Sigma = 1.8782 hours, Accel
VIA :
Split 4 - Tf
(Sigma = 2.59 hours, Accel
Conclusion:
All splits pass the minimum 10 years lifetime.
Rev. 0 – 2003 July
.1% exp
.1% exp
.1% exp
= ~ 28 hrs
= ~ 140 hrs
= ~ 22 hrs
temp
Tf
Tf
temp
temp
Tf
= 31.75, Accel
.01% op
.1% op
.01% op
= 130, Accel
= 130, Accel
= ~ 22 hrs x 7144 accel = 18 years.
= ~ 28 hrs x 39706 accel = 127 years.
= ~ 140 hrs x 39706 accel = 634 years.
current
current
current
= 225) (9/15 fails)
= 306)
= 306)
AT89C51RD2 / AT89C51ED2 QualPack
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