DA82562EZ Intel, DA82562EZ Datasheet - Page 37

• Manufacturer Part Number: DA82562EZ
• Description: 10/100 Mbps Platform LAN Connect
• Manufacturer: Intel

8.0
8.1
Datasheet
Figure 5. Dimension Diagram for the 196-pin BGA
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Package and Pinout Information
Package Information
The 82562EZ is a 196 Ball Grid Array (BGA) package. The package dimensions are shown in
Figure
Handbook, which is available from the Intel Developer website..
5. More information on Intel device packaging is available in the Intel Packaging
0.32 +/-0.04
Substrate change from
0.36 mm to 0.32 mm
1.56 +/-0.19
0.40 +/-0.10
0.85
Note: All dimensions are in millimeters.
Seating Plate
Networking Silicon — 82562EZ
30
o
31