S71PL032J SPANSION [SPANSION], S71PL032J Datasheet - Page 21

• Manufacturer Part Number: S71PL032J
• Description: STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
• Manufacturer: SPANSION [SPANSION]

TSC056—56-ball Fine-Pitch Ball Grid Array (FBGA)
9 x 7mm Package
November 22, 2004 S71PL254/127/064/032J_00_A6
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
A
MD
ME
D1
eD
A1
A2
E1
φb
eE
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
0.17
0.81
0.35
MIN
A1,A8,D4,D5,E4,E5,H1,H8
---
56X
9.00 mm x 7.00 mm
0.15
0.08
PACKAGE
INDEX MARK
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TSC 056
6
NOM
b
0.40
N/A
56
---
---
---
M
M
8
8
10
C
C
A d v a n c e
A B
SIDE VIEW
MAX
TOP VIEW
1.20
0.97
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
I n f o r m a t i o n
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
8
7
6
5
4
3
2
1
eD
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
H
SD
BOTTOM VIEW
G
7
F
E
D1
D C
B
A
SE
CORNER
PIN A1
7
3427 \ 16-038.22
E1
21