MT54W1MH36B-4 MICRON [Micron Technology], MT54W1MH36B-4 Datasheet - Page 26

• Manufacturer Part Number: MT54W1MH36B-4
• Manufacturer: MICRON [Micron Technology]

NOTE:
DATA SHEET DESIGNATION
Advance:
36Mb: 1.8V V
MT54W2MH18B_A.fm - Rev 9/02
1. All dimensions are in millimeters.
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semiconductor, IDT, Micron Technology,
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.40
SEATING PLANE
Micron and the M logo are registered trademarks and SyncBurst and the Micron logo are trademarks of Micron Technology, Inc.
DD
, HSTL, QDRIIb2 SRAM
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
165X
14.00
This data sheet contains initial descriptions of products still under development.
7.00 ±0.05
0.12 C
0.45
0.850 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
5.00 ±0.05
15.00 ±0.10
BALL A11
10.00
1.00
TYP
7.50 ±0.05
4 MEG x 8, 4 MEG x 9, 2 MEG x 18, 1 MEG x 36
Inc., NEC, and Samsung.
165-Ball FBGA
Figure 11
1.00
TYP
PIN A1 ID
8.50 ±0.10
BALL A1
26
17.00 ±0.10
®
1.8V V
1.20 MAX
DD
, HSTL, QDRIIb2 SRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2002, Micron Technology Inc.
ADVANCE