HI-6121PQMF HOLTIC [Holt Integrated Circuits], HI-6121PQMF Datasheet - Page 115

• Manufacturer Part Number: HI-6121PQMF
• Description: MIL-STD-1553 Remote Terminal ICs
• Manufacturer: HOLTIC [Holt Integrated Circuits]

64-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
52-PIN PLASTIC QUAD FLAT PACK (PQFP)
(9.00)
.354
(1.00)
.039
BSC
max
(1.6)
.063
(13.2)
.520
MAX.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC SQ
(9.00)
Top View
.354
BSC
See Detail A
HI-6120 & HI-6121 PACKAGE DIMENSIONS
(1.6)
.063
HOLT INTEGRATED CIRCUITS
typ
(0.20)
.008
Heat sink pad on bottom of package.
Heat sink must be left floating or
DO NOT connect to GND.
typ
(10.0)
.394
connected to VDD.
115
BSC SQ
(7.125
.281 ± .003
.055 .002
(1.4 .05)
±
±
± .075
(0.40
.016 ± .004
)
± .10
)
(7.125
(.13)
.005
.281 ± .003
Bottom
View
D
± .075
R min
(.20)
.008
ETAIL
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.035 .006
.0256
(.88 ± .15)
(.65)
inches (millimeters)
Package Type: 64PCS
inches (millimeters)
(.375 ± .075)
Package Type: 52PTQS
)
min
.015 .003
±
A
(.13)
BSC
.005
±
R min
(0.50)
(0.25)
.0197
.010
0°
typ
BSC
£ Q £
7°