dsPIC33FJ32MC104-I/PT Microchip Technology, dsPIC33FJ32MC104-I/PT Datasheet - Page 350
dsPIC33FJ32MC104-I/PT
Manufacturer Part Number
dsPIC33FJ32MC104-I/PT
Description
Digital Signal Processors & Controllers - DSP, DSC 16bit Mtr Cnt Fam 16 MIPS 32KBFLSH 2KBRAM
Manufacturer
Microchip Technology
Type
dsPIC33FJ32(GP/MC)101/102/104r
Datasheet
1.DSPIC33FJ32GP102-ISO.pdf
(386 pages)
Specifications of dsPIC33FJ32MC104-I/PT
Rohs
yes
Core
dsPIC33F
Data Bus Width
16 bit
Program Memory Size
32 KB
Data Ram Size
2 KB
Maximum Clock Frequency
7.37 MHz, 32 kHz
Number Of Programmable I/os
35
Number Of Timers
5 x 16-bit, 2 x 32-bit
Device Million Instructions Per Second
16 MIPs
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Package / Case
TQFP-44
Mounting Style
SMD/SMT
Family / Core
dsPIC33FJ32(GP/MC)101/102/104
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
Yes
Product
DSPs
Program Memory Type
Flash
Supply Current
10 mA
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC104-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70652E-page 350
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
e
A
E
b
L
c
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.310
.285
.130
.010
.050
.018
.135
28
–
–
–
Microchip Technology Drawing C04-070B
2011-2012 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c
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