LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 105
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LPC1112FHN33/202
Manufacturer Part Number
LPC1112FHN33/202
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1112FHN33/202
Rohs
yes
Core
ARM Cortex M0
Data Bus Width
32 bit
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
1 600
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC111X
Product data sheet
Fig 62. Reflow soldering of the HVQFN33 package (5x5)
Footprint information for reflow soldering of HVQFN33 package
Issue date
Dimensions in mm
0.5
P
solder land
solder paste
occupied area
5.95
Ax
11-11-15
11-11-20
5.95
Ay
4.25
Bx
see detail X
Hy
4.25
By
Gy
SLy
C
0.85
C
All information provided in this document is subject to legal disclaimers.
0.27
D
Rev. 8 — 20 February 2013
5.25
Gx
nSPx
5.25
Gy
SLx
Hx
Gx
Bx
Ax
6.2
Hx
D
nSPy
LPC1110/11/12/13/14/15
P
6.2
Hy
3.75
32-bit ARM Cortex-M0 microcontroller
SLx
By
3.75
SLy
Ay
nSPx
3
nSPy
detail X
3
© NXP B.V. 2013. All rights reserved.
0.30
0.60
002aag766
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