LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 106
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LPC1112FHN33/202
Manufacturer Part Number
LPC1112FHN33/202
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1112FHN33/202
Rohs
yes
Core
ARM Cortex M0
Data Bus Width
32 bit
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Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
1 600
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1112FHN33/202
Manufacturer:
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Quantity:
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NXP Semiconductors
LPC111X
Product data sheet
Fig 63. Reflow soldering of the HVQFN33 package (7x7)
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 8 — 20 February 2013
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2013. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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