LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 96

no-image

LPC1112FHN33/202

Manufacturer Part Number
LPC1112FHN33/202
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHN33/202

Rohs
yes
Core
ARM Cortex M0
Data Bus Width
32 bit

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
1 600
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
LPC1112FHN33/202
0
NXP Semiconductors
Fig 53. Package outline SOT117-1 (DIP28)
LPC111X
Product data sheet
DIP28: plastic dual in-line package; 28 leads (600 mil)
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Note
inches
UNIT
mm
SOT117-1
OUTLINE
VERSION
L
Z
max.
28
5.1
0.2
1
A
pin 1 index
min.
0.51
0.02
A
1
051G05
IEC
max.
0.16
A
4
2
0.066
0.051
1.7
1.3
b
e
D
0.020
0.014
All information provided in this document is subject to legal disclaimers.
MO-015
0.53
0.38
JEDEC
b
1
REFERENCES
Rev. 8 — 20 February 2013
0.013
0.009
0.32
0.23
c
0
b
1.41
1.34
D
36
35
SC-510-28
(1)
JEITA
scale
5
14.1
13.7
0.56
0.54
E
(1)
15
b
14
1
LPC1110/11/12/13/14/15
10 mm
2.54
0.1
e
A
1
w
E
M
A
15.24
2
0.6
32-bit ARM Cortex-M0 microcontroller
e
1
A
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
15.80
15.24
c
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
M
H
1
H
E
© NXP B.V. 2013. All rights reserved.
ISSUE DATE
0.25
0.01
99-12-27
03-02-13
w
SOT117-1
max.
0.067
1.7
Z
96 of 114
(1)

Related parts for LPC1112FHN33/202