LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 89

• Manufacturer Part Number: LPC1112FHN33/202
• Description: ARM Microcontrollers - MCU CortexM0 32bit 16KB
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN33/202

• Rohs: yes
• Core: ARM Cortex M0
• Data Bus Width: 32 bit

NXP Semiconductors
LPC111X
Product data sheet
11.4 XTAL Printed Circuit Board (PCB) layout guidelines
11.5 Standard I/O pad configuration
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
of third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Figure 47
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Digital output driver
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Digital input: Repeater mode enabled/disabled
Digital output: Pseudo open-drain mode enable/disabled
Analog input
shows the possible pin modes for standard I/O pins with analog input function:
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
LPC1110/11/12/13/14/15
X1
and C
32-bit ARM Cortex-M0 microcontroller
X2
should be chosen smaller
X1
, C
X2
© NXP B.V. 2013. All rights reserved.
, and C
X3
in case
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