MK60DN512VMC10 Freescale Semiconductor, MK60DN512VMC10 Datasheet - Page 36

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MK60DN512VMC10

Manufacturer Part Number
MK60DN512VMC10
Description
ARM Microcontrollers - MCU Kinetis 2.x 512K
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MK60DN512VMC10

Rohs
yes
Core
ARM Cortex M4
Processor Series
MK60DN512
Data Bus Width
32 bit
Maximum Clock Frequency
100 MHz
Program Memory Size
512 KB
Data Ram Size
128 KB
On-chip Adc
Yes
Operating Supply Voltage
1.71 V to 3.6 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
MAPBGA-121
Mounting Style
SMD/SMT
A/d Bit Size
16 bit
A/d Channels Available
2
Interface Type
CAN, I2C, I2S, SPI, UART, USB
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Number Of Timers
2
On-chip Dac
Yes
Program Memory Type
Flash
Supply Voltage - Max
3.6 V
Supply Voltage - Min
1.71 V
Peripheral operating requirements and behaviors
6.4.1.5 Write endurance to FlexRAM for EEPROM
When the FlexNVM partition code is not set to full data flash, the EEPROM data set size
can be set to any of several non-zero values.
The bytes not assigned to data flash via the FlexNVM partition code are used by the flash
memory module to obtain an effective endurance increase for the EEPROM data. The
built-in EEPROM record management system raises the number of program/erase cycles
that can be attained prior to device wear-out by cycling the EEPROM data through a
larger EEPROM NVM storage space.
While different partitions of the FlexNVM are available, the intention is that a single
choice for the FlexNVM partition code and EEPROM data set size is used throughout the
entire lifetime of a given application. The EEPROM endurance equation and graph
shown below assume that only one configuration is ever used.
Writes_subsystem =
where
36
• Writes_subsystem — minimum number of writes to each FlexRAM location for
• EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART;
• EEESPLIT — FlexRAM split factor for subsystem; entered with the Program
• EEESIZE — allocated FlexRAM based on DEPART; entered with the Program
• Write_efficiency —
• n
subsystem (each subsystem can have different endurance)
entered with the Program Partition command
Partition command
Partition command
cycles)
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• 0.25 for 8-bit writes to FlexRAM
• 0.50 for 16-bit or 32-bit writes to FlexRAM
— data flash cycling endurance (the following graph assumes 10,000
EEPROM – 2 × EEESPLIT × EEESIZE
K60 Sub-Family Data Sheet, Rev. 2, 12/2012.
EEESPLIT × EEESIZE
× Write_efficiency × n
Freescale Semiconductor, Inc.
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