MCIMX503EVM8B Freescale Semiconductor, MCIMX503EVM8B Datasheet

MCIMX503EVM8B

Manufacturer Part Number

MCIMX503EVM8B

Description

Processors - Application Specialized Codex Rev 1.1

Manufacturer

Freescale Semiconductor

Type

Multimedia Applicationsr

Datasheet

1.MCIMX503EVM8B.pdf (135 pages)

Specifications of MCIMX503EVM8B

Rohs

yes

Core

ARM Cortex A8

Processor Series

i.MX50

Data Bus Width

32 bit

Operating Supply Voltage

0.75 V to 1.275 V

Mounting Style

SMD/SMT

Package / Case

MAPBGA-400

Memory Type

L1/L2 Cache, ROM, SRAM

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

MCIMX503EVM8B

Manufacturer:

Freescale Semiconductor

Quantity:

10 000

Current page: 1 of 135
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Freescale reserves the right to change the detail specifications as may be required to permit improvements

in the design of its products.

Freescale Semiconductor

Data Sheet: Technical Data

i.MX50 Applications

Processors for

Consumer Products

The i.MX50 applications processors represent Freescale

Semiconductor’s latest addition to a growing family of

multimedia-focused products, offering high performance

processing optimized for lowest power consumption.

The i.MX50 is optimized for portable multimedia

applications and it features Freescale’s advanced

implementation of the ARM Cortex-A8™ core, which

operates at speed as high as 800 MHz. The i.MX50

provides a powerful display architecture, including a 2D

Graphics Processing Unit (GPU) and Pixel Processing

Pipeline (ePXP). In addition, i.MX508 includes a

complete integration of the electrophoretic display

function. The i.MX50 supports DDR2, LPDDR2, and

LPDDR1 DRAM at clock rate up to 266 MHz to enable

a range of performance and power trade-offs.

The flexibility of the i.MX50 architecture allows it to be

used in a variety of applications. As the heart of the

application chipset, the i.MX50 provides a rich set of

interfaces for connecting peripherals, such as WLAN,

Bluetooth™, GPS, and displays.

Introduction

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20

5. Package Information and Contact Assignments . . . . . 100

6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

1.1.

1.2.

1.3.

1.4.

1.5.

2.1.

3.1.

4.1.

4.2.

4.3.

4.4.

4.5.

4.6.

4.7.

4.8.

4.9.

5.1.

5.2.

5.3.

5.4.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

See

Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch

Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch

Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7

Part Number Feature Comparison . . . . . . . . . . . . . 7

Package Feature Comparison . . . . . . . . . . . . . . . . 8

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Special Signal Considerations . . . . . . . . . . . . . . . 17

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30

Output Buffer Impedance Characteristics . . . . . . 36

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40

System Modules Timing . . . . . . . . . . . . . . . . . . . . 47

External Interface Module (EIM) . . . . . . . . . . . . . . 59

DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 67

External Peripheral Interfaces . . . . . . . . . . . . . . . 72

13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 123

Table 1 on page 7

Document Number: IMX50CEC

Package Information

Ordering Information

MCIMX50

Plastic Package

for ordering information.

Rev. 4, 1/2013

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