MCIMX503EVM8B Freescale Semiconductor, MCIMX503EVM8B Datasheet - Page 23

• Manufacturer Part Number: MCIMX503EVM8B
• Description: Processors - Application Specialized Codex Rev 1.1
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX503EVM8B

• Rohs: yes
• Core: ARM Cortex A8
• Processor Series: i.MX50
• Data Bus Width: 32 bit
• Operating Supply Voltage: 0.75 V to 1.275 V
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-400
• Memory Type: L1/L2 Cache, ROM, SRAM

4.1.2.2
Table 9
1
2
3
4
5
6
4.1.2.3
Table 10
1
2
Freescale Semiconductor
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (at 200 ft/min)
Junction to Ambient (at 200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (at 200 ft/min)
Junction to Ambient (at 200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by using the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification.
provides thermal resistance data for a 13 x 13 mm PoPBGA package.
provides thermal resistance data for a 17 x 17 mm MAPBGA package.
13 x 13 mm PoPBGA Package
17 x 17 mm MAPBGA Package
5
5
4
4
Table 10. 17 x 17 mm MAPBGA Package Thermal Resistance Data
Table 9. 13 x 13 mm PoPBGA Package Thermal Resistance Data
Rating
Rating
i.MX50 Applications Processors for Consumer Products, Rev. 4
1, 3
1, 3
1, 3
1, 3
1, 2
1, 2, 3
1, 2
1, 2, 3
6
6
Thermal Resistance Data
Thermal Resistance Data
Four layer board (2s2p)
Four layer board (2s2p)
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Single layer board (1s)
Single layer board (1s)
Board
Board
—
—
—
—
—
—
Symbol
Symbol
R
R
R
R
R
R
R
R
R
R
R
R
Ψ
Ψ
θJMA
θJMA
θJMA
θJMA
θJA
θJA
θJB
θJC
θJA
θJA
θJB
θJC
JT
JT
Electrical Characteristics
Value
Value
18
44
26
57
31
46
28
53
30
19
6
8
2
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
23