MCIMX503EVM8B Freescale Semiconductor, MCIMX503EVM8B Datasheet - Page 133

• Manufacturer Part Number: MCIMX503EVM8B
• Description: Processors - Application Specialized Codex Rev 1.1
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX503EVM8B

• Rohs: yes
• Core: ARM Cortex A8
• Processor Series: i.MX50
• Data Bus Width: 32 bit
• Operating Supply Voltage: 0.75 V to 1.275 V
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-400
• Memory Type: L1/L2 Cache, ROM, SRAM

6
Table 85
Freescale Semiconductor
Number
Rev. 4
Rev. 3
Rev. 2
Rev.
Revision History
10/2012 • In
05/2012 • In
provides a revision history for this data sheet.
1/2013
Date
• In
• In
• In
• In
• Updated
• In
• In
• Added
• Added
• Added
• In
• In
• Added
• In
• Replace mDDR with LPDDR1 throughout the document.
—Changed DDR clock rate for reduced performance mode (RPM) of VCC from 100 MHz to 133 MHz
—Changed DDR clock rate for high performance mode (HPM) of VCC from 200 MHz to 266 MHz
MCIMX503CVK8B, MCIMX503EVM8B, MCIMX502CVK8B, and MCIMX502EVM8B.
DRAM_OPEN/DRAM_OPENFB and DRAM_SDODT0/DRAM_SDODT1
POP_EMMC_RST, POP_LPDDR2_ZQ0/ZQ1, POP_LPDDR2_1.8V, and POP_NAND_VCC.
USB_OTG_VDDA33.
—Added a new column “416 PoPBGA Ball Number”
—Changed “USB_H1_VDDA” to “USB_H1_VDDA25, USB_H1_VDDA33”
—Changed “USB_OTG_VDDA” to “USB_OTG_VDDA25, USB_OTG_VDDA33”
Table 1, "Ordering Information," on page
Table 1, "Ordering Information," on page
Table 77, "VBUS Comparators Thresholds," on page
Figure 27, "DTACK Read Access," on page
Table 11, "i.MX50 Operating Ranges," on page
Table 1, "Ordering Information," on page
Table 3, "Package Feature Comparison," on page
Table 5, "Special Signal Considerations," on page
Table 5, "Special Signal Considerations," on page
Table 11, "i.MX50 Operating Ranges," on page
Table 84, "Alphabetical List of Signal Assignments," on page
i.MX50 Applications Processors for Consumer Products, Rev. 4
Table 85. i.MX50 Data Sheet Document Revision History
Section 4.1.2.1, “13 x 13 mm MAPBGA Package Thermal Resistance Data.”
Section 4.1.2.2, “13 x 13 mm PoPBGA Package Thermal Resistance Data.”
Section 4.1.2.3, “17 x 17 mm MAPBGA Package Thermal Resistance Data.”
Section 5.2, “13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package Information.”
Figure 1, "i.MX50 System Block Diagram," on page 10
Substantive Change(s)
7, added the following new part numbers: MCIMX508CZK8B,
7, added new part number information for MCIMX507CVK8B.
7, added a new column, T
66, updated timing of EIM_DTACK.
24:
24, added footnotes for USB_OTG_VDDA25 and
8, added a new row for 416 PoPBGA package.
17, updated details for the following signals:
17, added new rows for the following signals:
100, changed VBUS input max current to 350 μA.
by removing “LDOx3” and “DC-DC 1.2V.”
123:
junction
.
Revision History
133