SST49LF016C-33-4C-WHE Microchip Technology, SST49LF016C-33-4C-WHE Datasheet - Page 24

• Manufacturer Part Number: SST49LF016C-33-4C-WHE
• Description: IC FLASH SER LPC 16MBIT 32TSOP
• Manufacturer: Microchip Technology

Specifications of SST49LF016C-33-4C-WHE

• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 32-TSOP
• Format - Memory: FLASH
• Speed: 33MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Data Bus Width: 8 bit
• Architecture: Sectored
• Interface Type: Parallel, Serial
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Current: 18 mA
• Mounting Style: SMD/SMT
• Organization: 4 KB x 512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Data Sheet
ELECTRICAL SPECIFICATIONS
The AC and DC specifications for the LPC interface signals (LAD[3:0], LFRAME#, LCLCK and RST#) as defined in Section
4.2.2.4 of the PCI local Bus specification, Rev. 2.1. Refer to Table 20 for the DC voltage and current specifications. Refer to
Table 24 through Table 26 for the AC timing specifications for Clock, Read, Write, and Reset operations.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to
Transient Voltage (<20 ns) on Any Pin (except WP#/AAI) to Ground Potential
Voltage on WP#/AAI Pin to Ground Potential
Package Power Dissipation Capability (T
Surface Mount Solder Reflow Temperature
Output Short Circuit Current
O
AC C
©2008 Silicon Storage Technology, Inc.
Range
Commercial
Input Rise/Fall Time . . . . . . . . . . . . . . . 3 ns
Output Load . . . . . . . . . . . . . . . . . . . . . C
See Figures 15 and 16
PERATING
1. Do not violate processor or chipset specification regarding INIT# voltage.
2. The maximum DC voltage on WP#/AAI pin may reach 11V for periods <20ns.
3. Excluding certain with-Pb 32-PLCC units, all packages are 260
4. Outputs shorted for no more than one second. No more than one output shorted at a time.
Certain with-Pb 32-PLCC package types are capable of 240
ONDITIONS OF
R
ANGE
Ambient Temp
0°C to +85°C
T
EST
4
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
L
= 30 pF
A
3.0-3.6V
=25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
3
V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 11.0V
°
C for 10 seconds; please consult the factory for the latest information.
°
24
C capable in both non-Pb and with-Pb solder versions.
1
. . . . . . . . . . . . . . -2.0V to
16 Mbit LPC Serial Flash
SST49LF016C
S71237-08-000
V
V
DD
DD
+0.5V
+2.0V
5/08