MD4832-D512-V3Q18-X/Y SanDisk, MD4832-D512-V3Q18-X/Y Datasheet - Page 18

• Manufacturer Part Number: MD4832-D512-V3Q18-X/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 585-1140

2.3
2.3.1 Ball Diagram
See Figure 4 for the Mobile DiskOnChip G3 1Gb standard interface ballout. To ensure proper
device functionality, balls marked RSRVD are reserved for future use and should not be connected.
Note: Mobile DiskOnChip G3 1Gb is designed as a drop-in replacement for Mobile DiskOnChip
9x12 FBGA Package
15
G3 512 Mb, assuming that the board was designed according to migration guide guidelines.
Refer to application note AP-DOC-067, Preparing your PCB Footprint for the DiskOnChip
BGA Migration Path, for further information.
1Gb Standard Interface
G
M
A
B
C
D
E
H
K
F
J
L
Figure 4 Ballout for Standard Interface (Mobile DiskOnChip G3 1Gb 9x12 FBGA Package)
1
M
M
A
M
M
M
M
RSRVD
DPD
CE#
A0/
A3
A2
A1
2
OE#
VSS
A7
A6
A5
A4
D0
D8
3
IF_CFG
RSRVD
RSRVD
RSRVD
Preliminary Data Sheet, Rev. 1.1
D10
D1
D9
D2
4
RSRVD
RSTIN#
BUSY#
VCC
D11
D3
5
RSRVD
RSRVD
VCCQ
WE#
CLK
D4
6
RSRVD
A10
D13
D12
A8
A9
D6
D5
7
DMARQ#
LOCK#
A11
A12
D15
D14
ID0
D7
8
RSRVD
RSRVD
RSRVD
IRQ#
VSS
ID1
9
Mobile DiskOnChip G3
10
M
M
M
M
M
M
91-SR-011-05-8L