MD4832-D512-V3Q18-X/Y SanDisk, MD4832-D512-V3Q18-X/Y Datasheet - Page 72

• Manufacturer Part Number: MD4832-D512-V3Q18-X/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 585-1140

9.3
With a multiplexed interface, Mobile DiskOnChip G3 requires the signals shown in Figure 23
below.
9.4
9.4.1
When using a standard NOR-like interface, connect the control signals as follows:
•
•
•
•
•
69
A[12:0] – Connect these signals to the host’s address signals (see Section 9.8 for
platform-related considerations). Address signal A[0] is multiplexed with the DPD signal.
D[15:0] – Connect these signals to the host’s data signals (see Section 9.8 for platform-related
considerations).
Output Enable (OE#) and Write Enable (WE#) – Connect these signals to the host RD# and
WR# signals, respectively.
Chip Enable (CE#) – Connect this signal to the memory address decoder. Most RISC
processors include a programmable decoder to generate various Chip Select (CS) outputs for
different memory zones. These CS signals can be programmed to support different wait states
to accommodate Mobile DiskOnChip G3 timing specifications.
Power-On Reset In (RSTIN#) – Connect this signal to the host active-low Power-On Reset
signal.
Multiplexed Interface
Connecting Control Signals
Standard Interface
Output Enable
Address/Data
Write Enable
Chip Enable
Chip ID
AVD#
Reset
0.1 uF
Figure 23: Multiplexed System Interface
AD[15:0]
OE#
CE#
ID0
WE#
RSTIN
AVD#
Preliminary Data Sheet, Rev. 1.1
#
10 nF
3.3 V
DiskOnChip G3
VCC
0.1 uF
Mobile
VSS
DMARQ#
BUSY#
LOCK#
1.8V or 3.3V
10 nF
VCCQ
DPD
IRQ#
CLK
1-20 KOhm
Mobile DiskOnChip G3
91-SR-011-05-8L