MD4832-D512-V3Q18-X/Y SanDisk, MD4832-D512-V3Q18-X/Y Datasheet - Page 22

• Manufacturer Part Number: MD4832-D512-V3Q18-X/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 585-1140

2.4
2.4.1 Pin/Ball Diagram
See Figure 6 and Figure 7 for the Mobile DiskOnChip G3 512Mb pinout/ballout for the multiplexed
interface. To ensure proper device functionality, pins/balls marked RSRVD are reserved for future
use and should not be connected.
Note: Third-generation Mobile DiskOnChip G3 is designed as a drop-in replacement for second-
TSOP-I Package
19
DMARQ#
RSTIN#
LOCK#
VCCQ
WE#
DPD
generation (G2) DiskOnChip Plus products, assuming that the latter were integrated according
to migration guide guidelines. Refer to application note AP-DOC-067, Preparing your PCB
Footprint for the DiskOnChip BGA Migration Path, for further information.
OE#
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CE#
Vcc
ID0
NC
512Mb Multiplexed Interface
Figure 6: Pinout for Multiplexed Interface (Mobile DiskOnChip 512Mb TSOP-I Package)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Mobile DiskOnChip G3 512Mb
Preliminary Data Sheet, Rev. 1.1
48-Pin TSOP-I
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Mobile DiskOnChip G3
91-SR-011-05-8L
VSS
IRQ#
AD15
AD14
AD13
AD12
AD11
AD10
AD9
AD8
CLK
VCCQ
GND
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
BUSY#
AVD#
VSS