PCF2113DH/4,557 NXP Semiconductors, PCF2113DH/4,557 Datasheet - Page 59

• Manufacturer Part Number: PCF2113DH/4,557
• Description: IC LCD CONTROLLER/DRIVER 100LQFP
• Manufacturer: NXP Semiconductors

Specifications of PCF2113DH/4,557

• Package / Case: 100-LQFP
• Display Type: LCD
• Configuration: 5 X 8 (Matrix)
• Interface: I²C
• Voltage - Supply: 2.2 V ~ 4 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 40
• Maximum Clock Frequency: 450 KHz
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 75 C
• Attached Touch Screen: No
• Maximum Supply Current: 50 mA
• Minimum Operating Temperature: - 20 C
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: LQFP
• Pin Count: 100
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935276328557; PCF2113DH/4; PCF2113DH/4

NXP Semiconductors
20. Soldering of SMD packages
PCF2113_FAM_4
Product data sheet
20.1 Introduction to soldering
20.2 Wave and reflow soldering
The orientation of the IC in a pocket is indicated by the position of the IC type name on the
die surface with respect to the chamfer on the upper left corner of the tray. Refer to the
bonding pad location diagram
on the die surface.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Fig 41. Tray alignment
•
•
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Rev. 04 — 4 March 2008
(Figure
3) for the orientation and position of the type name
PCF2113x
mgu207
LCD controllers/drivers
PCF2113x
© NXP B.V. 2008. All rights reserved.
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