PCA9512AD,112 NXP Semiconductors, PCA9512AD,112 Datasheet - Page 18

• Manufacturer Part Number: PCA9512AD,112
• Description: IC LEVSHIFT I2C/SMBUS BUFF 8SOIC
• Manufacturer: NXP Semiconductors
• Type: I²C-Bus and SMBus Switchr

Specifications of PCA9512AD,112

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Applications: Hot-Swap/SMB Buffer
• Internal Switch(s): Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Logic Family: PCA
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 3 / 3
• Logic Type: Bus Buffer
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3361-5; 935279721112; PCA9512AD

Philips Semiconductors
14. Soldering
PCA9512A_1
Product data sheet
14.1 Introduction to soldering surface mount packages
14.2 Reflow soldering
14.3 Wave soldering
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
•
•
•
•
below 225 C (SnPb process) or below 245 C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
– for packages with a thickness < 2.5 mm and a volume
below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
thick/large packages.
parallel to the transport direction of the printed-circuit board;
Rev. 01 — 7 October 2005
Level shifting hot swappable I
2.5 mm
3
so called small/thin packages.
2
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
C-bus and SMBus bus buffer
350 mm
PCA9512A
3
so called
18 of 22