PCA9512AD,112 NXP Semiconductors, PCA9512AD,112 Datasheet - Page 20

• Manufacturer Part Number: PCA9512AD,112
• Description: IC LEVSHIFT I2C/SMBUS BUFF 8SOIC
• Manufacturer: NXP Semiconductors
• Type: I²C-Bus and SMBus Switchr

Specifications of PCA9512AD,112

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Applications: Hot-Swap/SMB Buffer
• Internal Switch(s): Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Logic Family: PCA
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 3 / 3
• Logic Type: Bus Buffer
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3361-5; 935279721112; PCA9512AD

Philips Semiconductors
15. Abbreviations
16. Revision history
Table 8:
PCA9512A_1
Product data sheet
Document ID
PCA9512A_1
Revision history
Release date
20051007
[4]
[5]
[6]
[7]
[8]
[9]
Table 7:
Acronym
AdvancedTCA
CDM
cPCI
ESD
HBM
I
MM
PCI
PICMG
SMBus
VME
2
C-bus
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
Advanced Telecommunications Computing Architecture
Charged Device Model
compact Peripheral Component Interface
Electrostatic Discharge
Human Body Model
Inter IC bus
Machine Model
Peripheral Component Interface
PCI Industrial Computer Manufacturers Group
System Management Bus
VERSAModule Eurocard
Rev. 01 — 7 October 2005
Level shifting hot swappable I
Change notice
-
Doc. number
-
2
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
C-bus and SMBus bus buffer
PCA9512A
Supersedes
-
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