MC33888FB Freescale Semiconductor, MC33888FB Datasheet - Page 36

• Manufacturer Part Number: MC33888FB
• Description: IC SWITCH QUAD H-SIDE W/CS 64QFP
• Manufacturer: Freescale Semiconductor
• Type: High Side/Low Side Driverr

Specifications of MC33888FB

• Input Type: SPI
• Number Of Outputs: 12 ( 4 High Side, 8 Low Side)
• On-state Resistance: 40 mOhm
• Current - Output / Channel: 10A
• Current - Peak Output: 60A
• Voltage - Supply: 6 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 64-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device on Thermal Test Board
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33888
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
12.0 mm x 12.0 mm Body
33888 Pin Connections
36-Pin PQFN
0.8 mm Pitch
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
Figure 15. Thermal Test Board
Table 17. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Resistance
Ρ
Thermal
θJAmn
Ρθ
This device is a dual die package. Index m indicates the
JA
is the thermal resistance between die junction and
Area A
(mm
300
600
0
2
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n = 1
37
29
28
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
36
29
27
m = 2,
n = 2
37
30
29