LPC1114FBD48/301,1 NXP Semiconductors, LPC1114FBD48/301,1 Datasheet - Page 32

IC MCU 32BIT 32KB FLASH 48LQFP

LPC1114FBD48/301,1

Manufacturer Part Number
LPC1114FBD48/301,1
Description
IC MCU 32BIT 32KB FLASH 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC1100r

Specifications of LPC1114FBD48/301,1

Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
48-LQFP
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
42
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC1114
Development Tools By Supplier
OM11049, OM11085
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4950
935290789151

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FBD48/301,1
Manufacturer:
SAMSUNG
Quantity:
1 085
Part Number:
LPC1114FBD48/301,1
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Static characteristics
Table 7.
T
LPC1111_12_13_14
Product data sheet
Symbol
V
LPC1100 series (LPC111x/101/201/301) power consumption
I
LPC1100L series (LPC111x/102/202/302) power consumption in low-current mode
I
Standard port pins, RESET
I
I
I
DD
DD
IL
IH
OZ
amb
DD
= −40 °C to +85 °C, unless otherwise specified.
Static characteristics
Parameter
supply voltage (core
and external rail)
supply current
supply current
LOW-level input current V
HIGH-level input
current
OFF-state output
current
All information provided in this document is subject to legal disclaimers.
Conditions
Active mode; code
executed from flash
Sleep mode;
Deep-sleep mode;
V
Deep power-down mode;
V
Active mode; code
executed from flash
Sleep mode;
Deep-sleep mode;
V
Deep power-down mode;
V
resistor disabled
V
pull-down resistor
disabled
V
on-chip pull-up/down
resistors disabled
DD
DD
DD
DD
I
I
O
system clock = 12 MHz
system clock = 50 MHz
system clock = 12 MHz
system clock = 12 MHz
system clock = 50 MHz
system clock = 12 MHz
= 0 V; on-chip pull-up
= V
= 0 V; V
while(1){}
V
V
V
= 3.3 V
= 3.3 V
while(1){}
V
V
V
= 3.3 V
= 3.3 V
DD
DD
DD
DD
DD
DD
DD
Rev. 4 — 10 February 2011
; on-chip
= 3.3 V
= 3.3 V
= 3.3 V
= 3.3 V
= 3.3 V
= 3.3 V
O
= V
DD
;
[2][3][4]
[2][3][5]
[2][3][4]
[2][3][8]
[2][3][4]
[2][3][5]
[2][3][4]
[2][3][8]
[5][6]
[6][7]
[5][6]
[2][9]
[5][6]
[6][7]
[5][6]
[2][9]
32-bit ARM Cortex-M0 microcontroller
Min
1.8
-
-
-
-
-
-
-
-
-
-
-
-
-
LPC1111/12/13/14
[10]
Typ
3.3
3
9
2
6
220
2
7
1
2
220
0.5
0.5
0.5
[1]
© NXP B.V. 2011. All rights reserved.
Max
3.6
-
-
-
-
-
-
-
-
-
-
10
10
10
32 of 66
Unit
V
mA
mA
mA
μA
nA
mA
mA
mA
μA
nA
nA
nA
nA

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