LPC1114FBD48/301,1 NXP Semiconductors, LPC1114FBD48/301,1 Datasheet - Page 48

IC MCU 32BIT 32KB FLASH 48LQFP

LPC1114FBD48/301,1

Manufacturer Part Number
LPC1114FBD48/301,1
Description
IC MCU 32BIT 32KB FLASH 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC1100r

Specifications of LPC1114FBD48/301,1

Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
48-LQFP
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
42
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC1114
Development Tools By Supplier
OM11049, OM11085
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4950
935290789151

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FBD48/301,1
Manufacturer:
SAMSUNG
Quantity:
1 085
Part Number:
LPC1114FBD48/301,1
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
10. Dynamic characteristics
LPC1111_12_13_14
Product data sheet
10.1 Power-up ramp conditions
10.2 Flash memory
Table 11.
T
[1]
[2]
Table 12.
T
[1]
[2]
Symbol Parameter
t
t
V
Symbol
N
t
t
t
r
wait
ret
er
prog
amb
amb
Fig 24. Power-up ramp
I
endu
See
The wait time specifies the time the power supply must be at levels below 400 mV before ramping up.
Number of program/erase cycles.
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash
in blocks of 256 bytes.
= −40 °C to +85 °C.
= −40 °C to +85 °C, unless otherwise specified.
Figure
Condition: 0 < V
rise time
wait time
input voltage
Power-up characteristics
Flash characteristics
Parameter
endurance
retention time
erase time
programming
time
24.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 10 February 2011
I
≤ 400 mV at start of power-up (t = t
400 mV
Conditions
at t = t
at t = t
V
DD
0
Conditions
powered
unpowered
sector or multiple
consecutive
sectors
1
1
: 0 < V
on pin V
I
≤ 400 mV
DD
t = t
1
32-bit ARM Cortex-M0 microcontroller
[1]
[2]
1
)
LPC1111/12/13/14
Min
10000
10
20
95
0.95
t
wait
[1][2]
t
r
[1]
002aag001
Min
0
12
0
Typ
100000
-
-
100
1
Typ
-
-
-
© NXP B.V. 2011. All rights reserved.
Max
500
-
400
Max
-
-
-
105
1.05
48 of 66
Unit
ms
μs
mV
Unit
cycles
years
years
ms
ms

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