LPC1114FBD48/301,1 NXP Semiconductors, LPC1114FBD48/301,1 Datasheet - Page 56

• Manufacturer Part Number: LPC1114FBD48/301,1
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC1100r

Specifications of LPC1114FBD48/301,1

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC11
• Core: ARM Cortex M0
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART
• Number Of Programmable I/os: 28
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC1114
• Development Tools By Supplier: OM11049, OM11085
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4950; 935290789151

NXP Semiconductors
LPC1111_12_13_14
Product data sheet
11.3 XTAL Printed Circuit Board (PCB) layout guidelines
Table 19.
Table 20.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
Fundamental oscillation
frequency F
Fundamental oscillation
frequency F
15 MHz - 20 MHz
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
20 MHz - 25 MHz
1 MHz - 5 MHz
Fig 31. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C
Recommended values for C
components parameters) low frequency mode
Recommended values for C
components parameters) high frequency mode
OSC
OSC
All information provided in this document is subject to legal disclaimers.
XTALIN
C X1
LPC1xxx
Rev. 4 — 10 February 2011
XTAL
X1
Crystal load
capacitance C
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
Crystal load
capacitance C
10 pF
20 pF
10 pF
20 pF
/C
X2
XTALOUT
evaluation
C X2
X1
X1
/C
/C
L
L
X2
X2
in oscillation mode (crystal and external
in oscillation mode (crystal and external
Maximum crystal
series resistance R
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
Maximum crystal
series resistance R
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
=
x1
S
S
, C
L
C L
R S
x2
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
002aaf424
, and C
© NXP B.V. 2011. All rights reserved.
C P
x3
in case of
X1
X1
, C
, C
56 of 66
X2
X2