LPC1114FBD48/301,1 NXP Semiconductors, LPC1114FBD48/301,1 Datasheet - Page 34

IC MCU 32BIT 32KB FLASH 48LQFP

LPC1114FBD48/301,1

Manufacturer Part Number
LPC1114FBD48/301,1
Description
IC MCU 32BIT 32KB FLASH 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC1100r

Specifications of LPC1114FBD48/301,1

Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
48-LQFP
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
42
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC11
Core
ARM Cortex M0
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
28
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC1114
Development Tools By Supplier
OM11049, OM11085
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4950
935290789151

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FBD48/301,1
Manufacturer:
SAMSUNG
Quantity:
1 085
Part Number:
LPC1114FBD48/301,1
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 7.
T
LPC1111_12_13_14
Product data sheet
Symbol
V
V
V
V
I
I
I
I
I
I
V
V
V
I
I
I
Oscillator pins
V
V
OH
OL
OLS
pd
pu
2
OL
OL
LI
amb
IL
hys
OH
OL
C-bus pins (PIO0_4 and PIO0_5)
IH
IL
hys
i(xtal)
o(xtal)
= −40 °C to +85 °C, unless otherwise specified.
Static characteristics
Parameter
LOW-level input voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
HIGH-level output
current
LOW-level output
current
LOW-level short-circuit
output current
pull-down current
pull-up current
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
LOW-level output
current
LOW-level output
current
input leakage current
crystal input voltage
crystal output voltage
…continued
All information provided in this document is subject to legal disclaimers.
Conditions
2.5 V ≤ V
I
1.8 V ≤ V
I
2.0 V ≤ V
I
1.8 V ≤ V
I
V
2.5 V ≤ V
1.8 V ≤ V
V
V
V
V
V
V
configured as standard
mode pins
V
configured as Fast-mode
Plus pins
V
V
OH
OH
OL
OL
OH
OL
OL
I
I
DD
OL
OL
I
I
2.0 V ≤ V
1.8 V ≤ V
2.0 V ≤ V
1.8 V ≤ V
2.0 V ≤ V
1.8 V ≤ V
2.0 V ≤ V
1.8 V ≤ V
= 5 V
= 0 V
= V
= 5 V
= 4 mA
= 3 mA
= −20 mA
= −12 mA
= 0.4 V
= V
= 0.4 V; I
= 0.4 V; I
< V
= V
DD
Rev. 4 — 10 February 2011
DD
I
DD
DD
DD
DD
DD
< 5 V
DD
DD
− 0.4 V;
DD
DD
DD
DD
DD
DD
DD
DD
< 2.5 V;
< 2.0 V;
≤ 3.6 V;
≤ 3.6 V;
≤ 3.6 V
< 2.5 V
2
2
C-bus pins
C-bus pins
≤ 3.6 V
< 2.0 V
≤ 3.6 V
< 2.0 V
≤ 3.6 V
< 2.0 V
≤ 3.6 V
< 2.0 V
[14]
[15]
32-bit ARM Cortex-M0 microcontroller
Min
-
0.4
V
V
-
-
20
12
4
3
-
10
−15
−10
0
0.7V
-
-
3.5
3
20
16
-
-
−0.5
−0.5
DD
DD
LPC1111/12/13/14
− 0.4
− 0.4
DD
Typ
-
-
-
-
-
-
-
-
-
-
-
50
−50
−50
0
-
-
0.05V
-
-
-
-
2
10
1.8
1.8
[1]
DD
© NXP B.V. 2011. All rights reserved.
Max
0.3V
-
-
-
0.4
0.4
-
-
-
-
50
150
−85
−85
0
-
0.3V
-
-
-
-
-
4
22
1.95
1.95
DD
DD
34 of 66
Unit
V
V
V
V
V
V
mA
mA
mA
mA
mA
μA
μA
μA
μA
V
V
V
mA
mA
μA
μA
V
V

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