MC9S12XEP100CAG Freescale Semiconductor, MC9S12XEP100CAG Datasheet - Page 1073

• Manufacturer Part Number: MC9S12XEP100CAG
• Description: IC MCU 16BIT 1M FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 24-ch x 12-bit
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Package: 144LQFP
• Family Name: HCS12X
• Maximum Speed: 50 MHz
• Operating Supply Voltage: 1.8|2.8|5 V
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end
at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set.
Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT
register being set. The data value written corresponds to the number of 256 byte sectors allocated for either
direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART).
Freescale Semiconductor
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FERSTAT
Program a duplicate DFPART to the EEE nonvolatile information register at global address
0x12_0002 (see
Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see
Table
Program a duplicate ERPART to the EEE nonvolatile information register at global address
0x12_0006 (see
Register
FSTAT
27-7)
MGSTAT1
MGSTAT0
EPVIOLIF
ACCERR
Error Bit
FPVIOL
Table
Table
Table 27-78. Partition D-Flash Command Error Handling
27-7)
27-7)
MC9S12XE-Family Reference Manual , Rev. 1.23
Set if CCOBIX[2:0] != 010 at command launch
Set if a Load Data Field command sequence is currently active
Set if command not available in current mode (see
Set if partitions have already been defined
Set if an invalid DFPART or ERPART selection is supplied
None
Set if any errors have been encountered during the read
Set if any non-correctable errors have been encountered during the read
None
Error Condition
Chapter 27 512 KByte Flash Module (S12XFTM512K3V1)
Table
27-30)
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