C8051F353-GM Silicon Laboratories Inc, C8051F353-GM Datasheet - Page 127

• Manufacturer Part Number: C8051F353-GM
• Description: IC 8051 MCU 8K FLASH 28MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F35xr

Specifications of C8051F353-GM

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 17
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x16b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F350DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 16-bit
• On-chip Dac: 2-ch x 8-bit
• No. Of I/o's: 17
• Ram Memory Size: 768Byte
• Cpu Speed: 50MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Package: 28QFN
• Device Core: 8051
• Family Name: C8051F35x
• Maximum Speed: 50 MHz
• Data Rom Size: 128 B
• Height: 0.88 mm
• Length: 5 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Width: 5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1083 - DEV KIT FOR F350/351/352/353
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1273

16. External RAM
The C8051F350/1/2/3 devices include 512 bytes of RAM mapped into the external data memory space. All
of these address locations may be accessed using the external move instruction (MOVX) and the data
pointer (DPTR), or using MOVX indirect addressing mode. If the MOVX instruction is used with an 8-bit
address operand (such as @R1), then the high byte of the 16-bit address is provided by the External Mem-
ory Interface Control Register (EMI0CN as shown in SFR Definition 16.1). Note: the MOVX instruction is
also used for writes to the Flash memory. See Section “15. Flash Memory’ on page 121 for details. The
MOVX instruction accesses XRAM by default.
For a 16-bit MOVX operation (@DPTR), the upper 7-bits of the 16-bit external data memory address word
are "don't cares". As a result, the 512-byte RAM is mapped modulo style over the entire 64 k external data
memory address range. For example, the XRAM byte at address 0x0000 is shadowed at addresses
0x0200, 0x0400, 0x0600, 0x0800, etc. This is a useful feature when performing a linear memory fill, as the
address pointer doesn't have to be reset when reaching the RAM block boundary.
Bits 7–1: UNUSED. Read = 0000000b. Write = don’t care.
Bit 0:
R/W
Bit7
—
SFR Definition 16.1. EMI0CN: External Memory Interface Control
PGSEL: XRAM Page Select.
The EMI0CN register provides the high byte of the 16-bit external data memory address
when using an 8-bit MOVX command, effectively selecting a 256-byte page of RAM. Since
the upper (unused) bits of the register are always zero, the PGSEL determines which page
of XRAM is accessed.
For Example: If EMI0CN = 0x01, addresses 0x0100 through 0x01FF will be accessed.
R/W
Bit6
—
R/W
Bit5
—
R/W
Bit4
—
Rev. 1.1
R/W
Bit3
—
R/W
Bit2
—
C8051F350/1/2/3
R/W
Bit1
—
SFR Address:
PGSEL
R/W
Bit0
0xAA
00000000
Reset Value
127