C8051F353-GM Silicon Laboratories Inc, C8051F353-GM Datasheet - Page 132

• Manufacturer Part Number: C8051F353-GM
• Description: IC 8051 MCU 8K FLASH 28MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F35xr

Specifications of C8051F353-GM

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 17
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x16b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F350DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 16-bit
• On-chip Dac: 2-ch x 8-bit
• No. Of I/o's: 17
• Ram Memory Size: 768Byte
• Cpu Speed: 50MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Package: 28QFN
• Device Core: 8051
• Family Name: C8051F35x
• Maximum Speed: 50 MHz
• Data Rom Size: 128 B
• Height: 0.88 mm
• Length: 5 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Width: 5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1083 - DEV KIT FOR F350/351/352/353
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1273

C8051F350/1/2/3
The capacitors shown in the external crystal configuration provide the load capacitance required by the
crystal for correct oscillation. These capacitors are “in series” as seen by the crystal and “in parallel” with
the stray capacitance of the XTAL1 and XTAL2 pins.
Note: The load capacitance depends upon the crystal and the manufacturer. Please refer to the crystal
datasheet when completing these calculations.
For example, a tuning-fork crystal of 32.768 kHz with a recommended load capacitance of 12.5 pF should
use the configuration shown in Figure 17.1, Option 1. The total value of the capacitors and the stray
capacitance of the XTAL pins should equal 25 pF. With a stray capacitance of 3 pF per pin, the 22 pF
capacitors yield an equivalent capacitance of 12.5 pF across the crystal, as shown in Figure 17.2.
22 pF
XTAL1
Ω
32.768 kHz
10 M
XTAL2
22 pF
Figure 17.2. 32.768 kHz External Crystal Example
Important note on external crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
132
Rev. 1.1