C8051F353-GM Silicon Laboratories Inc, C8051F353-GM Datasheet - Page 88

• Manufacturer Part Number: C8051F353-GM
• Description: IC 8051 MCU 8K FLASH 28MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F35xr

Specifications of C8051F353-GM

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 17
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x16b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F350DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 16-bit
• On-chip Dac: 2-ch x 8-bit
• No. Of I/o's: 17
• Ram Memory Size: 768Byte
• Cpu Speed: 50MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Package: 28QFN
• Device Core: 8051
• Family Name: C8051F35x
• Maximum Speed: 50 MHz
• Data Rom Size: 128 B
• Height: 0.88 mm
• Length: 5 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Width: 5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1083 - DEV KIT FOR F350/351/352/353
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1273

C8051F350/1/2/3
Performance
The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the stan-
dard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system
clock cycles to execute, and usually have a maximum system clock of 12 MHz. By contrast, the CIP-51
core executes 70% of its instructions in one or two system clock cycles, with no instructions taking more
than eight system clock cycles.
With the CIP-51's system clock running at 50 MHz, it has a peak throughput of 50 MIPS. The CIP-51 has a
total of 109 instructions. The table below shows the total number of instructions that require each execution
time.
Programming and Debugging Support
In-system programming of the Flash program memory and communication with on-chip debug support
logic is accomplished via the Cygnal 2-Wire (C2) interface. Note that the re-programmable Flash can also
be read and changed a single byte at a time by the application software using the MOVC and MOVX
instructions. This feature allows program memory to be used for non-volatile data storage as well as updat-
ing program code under software control.
The on-chip debug support logic facilitates full speed in-circuit debugging, allowing the setting of hardware
breakpoints, starting, stopping and single stepping through program execution (including interrupt service
routines), examination of the program's call stack, and reading/writing the contents of registers and mem-
ory. This method of on-chip debugging is completely non-intrusive, requiring no RAM, Stack, timers, or
other on-chip resources.
The CIP-51 is supported by development tools from Silicon Labs and third party vendors. Silicon Labs pro-
vides an integrated development environment (IDE) including editor, macro assembler, debugger and pro-
grammer. The IDE's debugger and programmer interface to the CIP-51 via the on-chip debug logic to
provide fast and efficient in-system device programming and debugging. Third party macro assemblers
and C compilers are also available.
88
Number of Instructions
Clocks to Execute
26
1
50
2
2/3
Rev. 1.1
5
14
3
3/4
7
4
3
4/5
1
5
2
8
1