MCF5272VM66 Freescale Semiconductor, MCF5272VM66 Datasheet - Page 507

IC MPU 66MHZ COLDFIRE 196-MAPBGA

MCF5272VM66

Manufacturer Part Number
MCF5272VM66
Description
IC MPU 66MHZ COLDFIRE 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5272VM66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
32
Program Memory Size
16KB (4K x 32)
Program Memory Type
ROM
Ram Size
1K x 32
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
196-MAPBGA
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Cpu Speed
66MHz
Embedded Interface Type
UART, QSPI, USB, TDM
Digital Ic Case Style
BGA
No. Of Pins
196
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

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23.9
Table 23-17
1
2
3
4
Figure 23-17
Freescale Semiconductor
P1
P4
P5
P6
Name
P10
P11
For most telecommunications applications the period should be set to 125 µS. Refer to clock generator planning in PLIC
chapter.
Same as DCL0 and FSC0 if internal clock generator configured for pass-through mode.
GDCL1_OUT must be less than 1/20th of the CPU operating frequency. This is to ensure minimum jitter to CODECs that may
be connected to Ports 1,2,3.
Based on generated GDCL1_OUT less than 1/20 of CPU clock frequency.
P2
P3
P7
P8
P9
1, 2
3, 2
4, 2
4, 2
DOUT1, DOUT3
DIN1, DIN3
DFSC[3:1]
DFSC[1:3] period
Delay from rising edge of GDCL1_OUT to rising edge of DFSC[3:1]
Delay from rising edge of GDCL1_OUT to DFSC[3:1] Invalid (output Hold
GDCL1_OUT clock period
GDCL1_OUT pulse-width high
GDCL1_OUT pulse-width low
Delay from rising edge of GDCL1_OUT to Low-Z and valid data on DOUT[1,3]
Delay from rising edge of GDCL1_OUT to DOUT[3:1] Invalid (Output Hold)
Delay from rising edge of GDCL1_OUT to High-Z on DOUT[1,3]
Data valid on DIN[1:3] before falling edge of GDCL1_OUT (setup time)
Data valid on DIN[1:3] after falling edge of GDCL1_OUT (hold time)
GDCL1_OUT
PLIC Module: IDL and GCI Interface Timing Specifications
P2
shows timing for IDL master mode, PLIC ports 1, 2, and 3.
shows IDL master timings listed in
P7
MCF5272 ColdFire
Table 23-17. IDL Master Mode Timing, PLIC Ports 1, 2, and 3
P10
P3
Characteristic
Figure 23-17. IDL Master Timing
P5
®
Integrated Microprocessor User’s Manual, Rev. 3
P11
Table
P1
P6
P4
23-17.
P8
Min
20T
45
45
25
25
2
2
P9
Typ
125
50
50
Electrical Characteristics
Max
20
55
55
30
30
% of period
% of period
Unit
nS
nS
nS
nS
nS
µS
nS
nS
23-23

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