MCIMX357DVM5B Freescale Semiconductor, MCIMX357DVM5B Datasheet - Page 20

• Manufacturer Part Number: MCIMX357DVM5B
• Description: PROCESSOR MULTIMEDIA 400PBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX35r

Specifications of MCIMX357DVM5B

• Core Processor: ARM11
• Core Size: 32-Bit
• Speed: 532MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 400-BGA
• Operating Temperature (min): -20C
• Operating Temperature (max): 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: BGA
• No. Of Pins: 400
• Operating Temperature Range: -20°C To +70°C
• Processor Type: I.MX35
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

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2
3
4
4.7
I/O pins are of two types: GPIO and DDR. DDR pins can be configured in three different drive strength
modes: mobile DDR, SDRAM, and DDR2. The SDRAM and mobile DDR modes can be further
customized at three drive strength levels: normal, high, and max.
Table 13
20
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to boards
Junction to case (top)
Junction to package top
Mobile DDR (1.8 V)
SDRAM (1.8 V)
SDRAM (3.3 V)
DDR2 (1.8 V)
Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for this
package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
Drive Mode
shows currents for the different DDR pin drive strength modes.
I/O Pin DC Electrical Characteristics
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1
1
1
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i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
natural convection
natural convection
(at 200 ft/min)
(at 200 ft/min)
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4
Rating
Table 13. DDR Pin Drive Strength Mode Current Levels
Table 12. Thermal Resistance Data
Normal
3.6 mA
4 mA
—
—
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Condition
—
—
7.2 mA
High
8 mA
—
—
Symbol
R
R
R
R
R
R
eJCtop
Ψ
eJMA
eJMA
eJA
eJA
eJB
JT
Freescale Semiconductor
10.8 mA
13.4 mA
6.5 mA
12 mA
Max.
Value
53
30
44
27
19
10
2
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
Unit